Intelligent molecular beam epitaxy system for cost-effective manufacturing of compound semiconductor epi-wafers

Abstract

In situ non-invasive process monitoring and control during semiconductor epitaxy has been recognized as an enabling technology that can potentially transform existing approaches to epi-wafer manufacturing. We review the evolution of sensor-based MBE systems over the past 10 years, and present recent results of a sensor-based MBE system operating under a production environment. Finally, we discuss some technical challenges towards the realization of a futuristic intelligent epitaxy system.