{"title":"Defect tolerance and yield for a wafer scale FFT processor system","authors":"V. Jain, H. Hikawa, E. Swartzlander","doi":"10.1109/ICWSI.1991.151696","DOIUrl":null,"url":null,"abstract":"A wafer scale system for frame-by-frame computation of the fast Fourier-transform (FFT) is described. It is based on an eight-point FFT wafer design, which uses two types of cells, a multiply-subtract-add (MSA) cell and a coefficient ROM cell. Systematic repetition of these cells and the interconnect forms the physical wafer. The cells are designed for high performance and testability. For successive 512-point frames, the throughput is estimated at 20 million samples/s. Innovations in preplacement have reduced the traffic in the interconnect channels while enhancing the reconfigurability in the presence of defects. Estimates of wafer yield using a new model for harvesting probability are also presented.<<ETX>>","PeriodicalId":413164,"journal":{"name":"1991 Proceedings, International Conference on Wafer Scale Integration","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1991 Proceedings, International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1991.151696","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
A wafer scale system for frame-by-frame computation of the fast Fourier-transform (FFT) is described. It is based on an eight-point FFT wafer design, which uses two types of cells, a multiply-subtract-add (MSA) cell and a coefficient ROM cell. Systematic repetition of these cells and the interconnect forms the physical wafer. The cells are designed for high performance and testability. For successive 512-point frames, the throughput is estimated at 20 million samples/s. Innovations in preplacement have reduced the traffic in the interconnect channels while enhancing the reconfigurability in the presence of defects. Estimates of wafer yield using a new model for harvesting probability are also presented.<>