Test chip development to support standardization efforts

Abstract

A test chip has been developed which integrates test structures for performing reliability testing, and thermal and electrical characterization on packages and assembly processes. This work supports test chip standardization efforts of the Semiconductor Assembly Council (SAC) and the JEDEC JC15 Electrical Measurements and Simulation committee. For the purpose of reliability qualifications, several single-metal structures are provided to evaluate the environmental integrity of the package. Characterization structures, such as a capacitor for moisture monitoring, a strain gauge rosette, diodes, a heating resistor, and custom digital drivers have been integrated to quantify the mechanical, thermal, and electrical performance aspects of the package. This paper provides an overview of the test die functionality and discusses the application of each test sensor.