Characteristics of ultra-thin MEMS mirror device on flexibe substrate

2017 International Conference on Optical MEMS and Nanophotonics (OMN) Pub Date : 2017-08-01 DOI:10.1109/OMN.2017.8051489

T. Takeshita, T. Yamashita, N. Makimoto, T. Kobayashi

引用次数: 0

Abstract

We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.

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柔性基板上超薄MEMS反射器件的特性

我们开发了超薄MEMS镜像器件。镜面器件的厚度为5.31 μm，包括硅结构和致动器。在SOI晶片上沉积了Pt/SRO/PZT/SRO/Pt/Ti/SiO2。该装置粘接在柔性聚酰亚胺基板上，并使用粘合传递和导电浆料布线。在弯曲的基板上操作镜面装置。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 International Conference on Optical MEMS and Nanophotonics (OMN)

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