Safe Operating Area from Self-Heating, Impact Ionization, and Hot Carrier Reliability for a SiGe HBT on SOI

Jonggook Kim, A. Sadovnikov, Tianbing Chen, J. Babcock
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引用次数: 11

Abstract

A unified electro-thermal safe operating area (SOA) expression is proposed in this paper to evaluate self heating, impact ionization, and hot carrier (HC) degradation effects simultaneously in a full range of bipolar transistor operation. This SOA is demonstrated by experiments for a SiGe hetero-junction bipolar transistor (HBT) fabricated on silicon on insulator (SOI) by extracting principle parameters from discrete transistors and current mirrors. Also, time dependent reliability tests have been fulfilled for several meaningful bias points within this SOA at the fixed VBE and VCE. Avalanche induced HC injection was another important factor to restrict device performance. Finally, the modified electro-thermal SOA by HC reliability is suggested here.
SOI上SiGe HBT自热、冲击电离和热载流子可靠性的安全操作区域
本文提出了一个统一的电热安全操作区域(SOA)表达式,用于同时评估双极晶体管全范围工作中的自加热、冲击电离和热载流子(HC)降解效应。通过从分立晶体管和电流镜中提取原理参数,对基于绝缘体上硅(SOI)的SiGe异质结双极晶体管(HBT)进行了实验验证。此外,在固定的VBE和VCE上,已经完成了此SOA中几个有意义的偏差点的时间相关可靠性测试。雪崩诱导HC注射是限制器件性能的另一个重要因素。最后,提出了基于HC可靠性的电热SOA改进方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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