An electrical-aware parametric DFM solution for analog circuits

R. Salem, A. Arafa, Sherif Hany, Abdelrahman ElMously, H. Eissa, M. Dessouky, D. Nairn, M. Anis
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Abstract

Today, many of the approaches that are commonly referred to as physical DFM techniques only address catastrophic defects and systematic process variations. These techniques include spreading wires, doubling vias, identification of critical areas in the circuit that are especially susceptible to defects, and identification of proximity effects caused by the lithography process. However, physical DFM tools are purely “geometric”, in that they work to preserve shape fidelity without any knowledge of the impact on the electrical characteristics of the shapes that are manufactured in silicon. While these techniques have proven useful in reducing functional failures and increasing overall yield by a few percentage points, they completely ignore the more important category of parametric failures. The proposed solution presented in this chapter specifically helps to address the parametric performance modeling problems encountered at smaller geometries. As this solution drives design requirements into physical layout design and moves layout awareness upstream into design, useful information about the design (on the physical and electrical level) is captured, analyzed, and simulated. Deviations in the electrical characteristics due to physical layout and process variations, are identified and highlighted on the design. These deviations are referred as electrical hotspots (e-hotspots). To validate this work, The proposed e-hotspot detection engine is verified against silicon wafer data for a level shifter circuit designed at 130nm. The e-hotspot devices with high variation in DC current and causing parametric failure, are identified.
模拟电路的电感知参数DFM解决方案
今天,许多通常被称为物理DFM技术的方法只处理灾难性缺陷和系统过程变化。这些技术包括扩展导线,双通孔,识别电路中特别容易受到缺陷影响的关键区域,以及识别由光刻工艺引起的接近效应。然而,物理DFM工具是纯粹的“几何”,因为它们的工作是保持形状的保真度,而不知道对硅制造的形状的电气特性的影响。虽然这些技术已被证明在减少功能性故障和提高总体产量方面很有用,但它们完全忽略了更重要的参数故障类别。本章提出的解决方案特别有助于解决在较小几何形状中遇到的参数化性能建模问题。由于该解决方案将设计需求驱动到物理布局设计中,并将布局意识上游移动到设计中,因此可以捕获、分析和模拟有关设计的有用信息(在物理和电子级别上)。由于物理布局和工艺变化导致的电气特性偏差,应在设计中加以识别和突出。这些偏差被称为电热点(e-热点)。为了验证这一工作,我们用设计在130nm的电平移位电路的硅片数据验证了所提出的e热点检测引擎。识别出直流电流变化大、易引起参数失效的e热点器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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