Discrete event simulation modeling for semiconductor fabrication operation

2014 IEEE International Conference on Semiconductor Electronics (ICSE2014) Pub Date : 2014-10-13 DOI:10.1109/SMELEC.2014.6920863

M. A. Chik, A. Rahim, A. Z. M. Rejab, K. Ibrahim, U. Hashim

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引用次数: 14

Abstract

This research is to investigate simulation modeling method for semiconductor fabrication factories (FAB) that known for complex manufacturing operation from various the literatures. This paper covers literatures from various publications since past 10 years. The significant simulation model used in common and semiconductor fabrication will be selected for evaluation in semiconductor fabrication manufacturing operation scenario with high mixed. Depends to the products mixed configuration, cycle time to complete semiconductor fabrication will take 60 to 90 days. The longer period needed due to wafer process required 300 to 1000 steps, process re-entrance to similar equipment more than 30% of the total steps further increase the complexity with many configuration due to setup changes. The simulation also needs to configure for process queue time, process dedication, several of difference for equipment configuration, capability and capacity. Primary simulation techniques reviewed in this analysis are discrete event, petri-net, gaming, virtual, intelligent, monte carlo and hybrid to understand individual strength and common usage in the market. This research summarized the highest usage, most uses and compatibility in similar operation for semiconductor fabrication. In summary, the research concluded DES is the most suitable technique for simulating FAB operation because of its nature of queuing and leaving concept that fits and resulted to 95% accuracy for WIP forecasting.

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半导体制造操作的离散事件模拟建模

摘要本研究旨在探讨以复杂制造作业著称的半导体制造工厂(FAB)的仿真建模方法。本文涵盖了近10年来各种出版物的文献。在高混合的半导体制造操作场景中，选择通用制造和半导体制造中使用的重要仿真模型进行评估。根据产品的混合配置，完成半导体制造的周期时间将需要60至90天。晶圆工艺所需的时间较长，需要300到1000个步骤，重复进入类似设备的过程超过总步骤的30%，由于设置更改，许多配置进一步增加了复杂性。仿真还需要对流程排队时间、流程专用、设备配置、能力和容量等几种差异进行配置。本分析中回顾的主要模拟技术有离散事件、petri-net、游戏、虚拟、智能、蒙特卡罗和混合，以了解个人实力和市场上的常用情况。本研究总结了在半导体制造的类似操作中最高的用途、最多的用途和兼容性。综上所述，研究得出结论，DES是最适合模拟FAB操作的技术，因为它的排队和离开概念的性质适合并导致在制品预测的准确率达到95%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2014 IEEE International Conference on Semiconductor Electronics (ICSE2014)

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