Logical data packing for multi-chip flash-memory storage systems

Ming-Chang Yang, Yuan-Hao Chang, Yu-Cheng Chang, Po-Chun Huang
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引用次数: 1

Abstract

The multi-chip architecture is a popular development trend to let flash storage devices support both high access parallelism and large storage capacity. Nevertheless, the adoption of multi-chip architecture might contradict the design goal of some existing designs. For example, parallel accesses/writes to multiple chips could hinder the outcome of hot/cold data separation. Different from the existing hot/cold separation designs that only separate frequently accessed data from infrequently accessed ones, this work puts forward the concept of logical data packing to improve the performance of multi-chipped flash storage devices. In particular, by capturing both temporal and spatial localities of data accesses, the proposed logical data packing design can proactively store data in proper physical space so that the data migration overheads during garbage collection can be minimized. The proposed scheme was evaluated based on representative realistic workloads. The results show that the proposed design can improve the device performance by 5%-61% and extend the device lifetime by 6.5%-15.5%.
多芯片闪存存储系统的逻辑数据封装
多芯片架构是一个流行的发展趋势,使闪存设备既支持高访问并行性又支持大存储容量。然而,采用多芯片架构可能与一些现有设计的设计目标相矛盾。例如,对多个芯片的并行访问/写入可能会阻碍热/冷数据分离的结果。不同于现有的热/冷分离设计仅将频繁访问的数据与非频繁访问的数据分离,本文提出了逻辑数据封装的概念,以提高多芯片闪存存储设备的性能。特别是,通过捕获数据访问的时间和空间位置,所提出的逻辑数据打包设计可以主动将数据存储在适当的物理空间中,从而最大限度地减少垃圾收集期间的数据迁移开销。根据具有代表性的实际工作量对所提出的方案进行了评价。结果表明,该设计可使器件性能提高5% ~ 61%,器件寿命延长6.5% ~ 15.5%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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