Zhengyuan Zhang, Z. Wen, Shilu Xu, Zhengfan Zhang, Gang Chen, Shanglian Huang
{"title":"Optimization of Q factor in spiral inductor on silicon","authors":"Zhengyuan Zhang, Z. Wen, Shilu Xu, Zhengfan Zhang, Gang Chen, Shanglian Huang","doi":"10.1109/ICSICT.2001.981467","DOIUrl":null,"url":null,"abstract":"In this paper, analyzing the Q factor of the spiral inductor is done by computer simulation, the results showed that the series resistance R/sub s/ dominates the Q factor of the spiral inductor, and that increasing the substrate silicon resistance is beneficial to increasing the Q factor and decreasing the substrate noise. To increase the Q factor of the spiral inductor, the experiments of decreasing via contact resistance and etching away the substrate silicon under the spiral inductor are done. The compatibility of the 3-dimensional bulk process with the planar IC process has been solved. Using the novel method, the inductor with high Q factor of 8.4 and low series resistance of 3 /spl Omega/ is obtained, and substrate noise is reduced. This method can be used effectively in the design and manufacturing of high performance RF-ICs.","PeriodicalId":349087,"journal":{"name":"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)","volume":"288 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.2001.981467","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
In this paper, analyzing the Q factor of the spiral inductor is done by computer simulation, the results showed that the series resistance R/sub s/ dominates the Q factor of the spiral inductor, and that increasing the substrate silicon resistance is beneficial to increasing the Q factor and decreasing the substrate noise. To increase the Q factor of the spiral inductor, the experiments of decreasing via contact resistance and etching away the substrate silicon under the spiral inductor are done. The compatibility of the 3-dimensional bulk process with the planar IC process has been solved. Using the novel method, the inductor with high Q factor of 8.4 and low series resistance of 3 /spl Omega/ is obtained, and substrate noise is reduced. This method can be used effectively in the design and manufacturing of high performance RF-ICs.