Capacitive impacts of dummies on interconnect propagation performances for integrated circuits of the 65 nm node and below

B. Blampey, B. Fléchet, A. Farcy, U. Bermond, O. Cueto, J. Torres, G. Angénieux
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引用次数: 3

Abstract

The placement and size of square dummies degrade electrical performances mainly in terms of interconnect capacitance and propagation delay time. Electrical parameters for an isolated interconnect are obtained in a whole spectrum (up to 40 GHz) by electromagnetic modeling. Parasitic effects could be traduced by a fictitious increase of the relative permittivity k-value of inter-level dielectric cutting down performances of porous ULK integration for future 65 and 45 nm technology nodes. The capacitive effect of dummies on the interconnect test structure with a dielectric at k=2.7 was found, in some situations, to be equivalent to that obtained with a dielectric at k=3.2 without dummies. The capacitive effect of dummy distribution was also shown to be generally inhomogeneous, dramatically depending on dummy size and local interconnect design. However, an optimal size of dummies could be determined, leading to an homogeneous capacitive degradation effect, independent of the local interconnect dummy surrounding situation.
电容性假体对65nm及以下节点集成电路互连传播性能的影响
方形假人的放置位置和尺寸主要在互连电容和传播延迟时间方面降低电气性能。通过电磁建模,获得了隔离互连在40ghz以内全频谱范围内的电气参数。寄生效应可以通过虚构的层间介电相对介电常数k值的增加来消除,从而降低未来65和45 nm技术节点的多孔ULK集成性能。在某些情况下,假人对介电k=2.7的互连测试结构的电容效应与k=3.2的介电条件下无假人的电容效应相当。假人分布的电容效应通常是不均匀的,很大程度上取决于假人尺寸和局部互连设计。然而,可以确定假人的最佳尺寸,导致均匀的电容退化效应,独立于局部互连假人周围的情况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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