End users access to prototype and production MCMs

G. Forman, C. A. Becker, M. Eskew, R. Huegel, D. Smith, R. Jordan
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引用次数: 2

Abstract

The authors point out that the GE high density interconnect multichip module (HDI MCM) process has been broadly applied to many types of advanced system architectures, and recently the CAD technology has been transferred into the hands of a community of system designers. This HDI CAD process is based on a commercial, non-proprietary tool suite that has been successfully utilized at more than 10 remote sites. The dissemination of the GE HDI design methodology to various sites is detailed, and the CAD tools and techniques involved with the HDI interface to both the GE prototype and TI Merchant MCM Foundry are compared. Several HDI project case studies involving CAD tool usage and module production, from chip procurement and design transition to finished, tested modules, are described.<>
最终用户访问原型和生产mcm
作者指出,GE高密度互连多芯片模块(HDI MCM)工艺已广泛应用于许多类型的先进系统架构,并且最近CAD技术已转移到系统设计师社区手中。这个HDI CAD过程基于一个商业的、非专有的工具套件,该工具套件已在10多个远程站点成功使用。详细介绍了GE HDI设计方法在各个站点的传播情况,并比较了GE原型机和TI商用MCM铸造厂的HDI接口所涉及的CAD工具和技术。介绍了几个HDI项目案例研究,涉及CAD工具的使用和模块生产,从芯片采购和设计过渡到成品,测试模块。
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