A Novel Real-Time Junction Temperature Monitoring Circuit for SiC MOSFET

Hengyu Yu, Xi Jiang, Jianjun Chen, Jun Wang, Z. Shen
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引用次数: 6

Abstract

Junction temperature is a critical parameter for indicating the health condition of power devices in converters. Temperature sensitive electrical parameters (TSEPs) provide a viable method for extracting junction temperature of power devices in real-time operation. However, a few studies focus on practical implementations methods for SiC devices. This paper proposed a novel real-time junction temperature monitoring circuit for SiC MOSFET based on its quasi-threshold voltage (quasi-Vth) without complex circuits and current sensors. Furthermore, the effects of load current and DC bus voltage on junction temperature of SiC MOSFET extraction are analyzed. The experimental result shows that the quasi-Vth of SiC MOSFET extracted by the proposed measurement circuit has a sensitivity of -4.37mV/°C and is independent of load current.
一种新型的SiC MOSFET结温实时监测电路
结温是反映变换器电源器件健康状况的关键参数。温度敏感电参数为实时提取电力器件的结温提供了一种可行的方法。然而,很少有研究集中在SiC器件的实际实现方法上。提出了一种基于准阈值电压(准vth)的新型SiC MOSFET结温实时监测电路,无需复杂电路和电流传感器。分析了负载电流和直流母线电压对SiC MOSFET提取结温的影响。实验结果表明,该测量电路提取的SiC MOSFET准vth值灵敏度为-4.37mV/°C,且与负载电流无关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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