CIM strategy for semiconductor fab-building blocks approach

G. Baweja, B. OuYang
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引用次数: 2

Abstract

The semiconductor manufacturing process is very complicated. The operations are performed on different tools, supplied by different vendors, forcing many semiconductor manufacturers to adopt computer integrated manufacturing (CIM). The challenge in integrating semiconductor-manufacturing environment comes from connectivity and configurability. The CIM strategy for semiconductor fab described in this paper, is developed using building blocks. The building blocks can be seen as a collection of resources-both physical and functional, which can be used individually. These building blocks interact within a loosely coupled framework for task execution, thus allowing the flexibility of adding/changing functionality with minimal impact on the existing system. This is demonstrated by adding various optional building blocks like real-time data acquisition and advanced process control blocks to the CIM application. The base application framework has been used to integrate more than 250 semiconductor manufacturing tools from various vendors at TI semiconductor fab.
半导体晶圆厂构建块方法的CIM策略
半导体的制造过程非常复杂。这些操作在不同的工具上执行,由不同的供应商提供,迫使许多半导体制造商采用计算机集成制造(CIM)。集成半导体制造环境的挑战来自于连接性和可配置性。本文描述的半导体晶圆厂的CIM策略是使用构建块开发的。构建块可以看作是资源的集合——物理的和功能的,它们可以单独使用。这些构建块在任务执行的松耦合框架内进行交互,从而允许在对现有系统影响最小的情况下灵活地添加/更改功能。通过向CIM应用程序添加各种可选构建块(如实时数据采集和高级过程控制块)来演示这一点。基础应用程序框架已用于集成来自TI半导体工厂不同供应商的250多个半导体制造工具。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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