M. Pelella, J. Fossum, Dongwoo Suh, S. Krishnan, K. Jenkins
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引用次数: 37
Abstract
Partially-depleted (PD) SOI MOSFETs offer improved threshold control and sensitivity over fully depleted devices, but the effects of dynamic floating-body charging on the threshold voltage VT(t) can possibly lead to instabilities in PD/SOI circuits. We show in this paper that the dynamic charging of the body can also induce a parasitic bipolar-transistor (BJT) transient current which can be significant even at low voltages well below the drain-source breakdown defined by the BJT. Our results indicate that if device/circuit design allows substantial variation of the body charge, then the transient BJT current could be large enough to upset the logic or memory (SRAM or DRAM) function of a chip. They further show that such an upset becomes more probable as the device is scaled, and they give insight regarding device and circuit design to reduce the probability.
与完全耗尽器件相比,部分耗尽(PD) SOI mosfet提供了更好的阈值控制和灵敏度,但动态浮体充电对阈值电压VT(t)的影响可能导致PD/SOI电路的不稳定。我们在本文中表明,体的动态充电也可以诱导寄生双极晶体管(BJT)瞬态电流,即使在远低于BJT定义的漏源击穿的低电压下,该电流也可以显着。我们的研究结果表明,如果器件/电路设计允许本体电荷的实质性变化,那么瞬态BJT电流可能大到足以扰乱芯片的逻辑或内存(SRAM或DRAM)功能。他们进一步表明,随着设备的缩放,这种混乱变得更有可能,并且他们提供了有关设备和电路设计的见解,以降低概率。