{"title":"Implementation considerations for RAMBUS/sup TM/-based systems","authors":"R. J. Evans, J. Diepenbrock, R. Sharrar","doi":"10.1109/EPEP.1999.819184","DOIUrl":null,"url":null,"abstract":"Implementation of high bandwidth memory architectures presents many new design challenges. These include new memory socket designs, new process control and monitoring capabilities for PC board manufacturers, new tools and techniques for board designers, and investment in test equipment. This paper looks at a number of design challenges encountered in developing Direct RAMBUS/sup TM/ based designs.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"62 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819184","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Implementation of high bandwidth memory architectures presents many new design challenges. These include new memory socket designs, new process control and monitoring capabilities for PC board manufacturers, new tools and techniques for board designers, and investment in test equipment. This paper looks at a number of design challenges encountered in developing Direct RAMBUS/sup TM/ based designs.