Influence of annealing on electrical properties of AlGaN/GaN HFETs and MOSHFETs using A12O3

R. Stoklas, D. Gregušová, J. Novák, P. Kordos
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Abstract

Thermal annealing was used to investigate traps at the surface of AlGaN/GaN HFETs and Al2O3/AIGaN/GaN MOSHFETs. The C-V and static output and transfer measurement yielded nearly identical characteristics for unannealed and annealed structures, regardless whether unpassivated or gate-oxide structures were used. A strong influence of the annealing on the gate leakage current was observed. The leakage currents were lowered by about two orders of magnitude, which is indicative of an efficient reduction of traps in the AlGaN/GaN heterostructure because of annealing.
退火对A12O3制备AlGaN/GaN hfet和moshfet电性能的影响
采用热退火方法研究了Al2O3/AIGaN/GaN moshfet和AlGaN/GaN hfet表面的陷阱。无论使用未钝化结构还是栅极氧化结构,未退火和退火结构的C-V和静态输出和传递测量结果几乎相同。观察到退火对栅漏电流有很强的影响。泄漏电流降低了约两个数量级,这表明退火有效地减少了AlGaN/GaN异质结构中的陷阱。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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