The integration of SWNTs with CMOS IC after covering Nickel/Gold on the Aluminum electrodes

Abstract

This paper presents the interconnection of single -walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35µm CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between electrodes. Using Electroless Nickel and Immersion Gold to cover the electrodes of Al could really increase the current more than 3 orders when SWNTs are connected between electrodes.