Transmitter PIC for THz applications based on generic integration technology

2013 International Conference on Indium Phosphide and Related Materials (IPRM) Pub Date : 2013-05-19 DOI:10.1109/ICIPRM.2013.6562628

F. Soares, J. Kreissl, M. Theurer, E. Bitincka, T. Goebel, M. Moehrle, N. Grote

引用次数: 7

Abstract

A generic InP based monolithic photonic integration platform is introduced that is capable of simultaneously incorporating transmitter, receiver and passive-optical functionalities. On this basis, an integrated transmitter component for THz applications has been implemented.

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基于通用集成技术的太赫兹应用的发射机PIC

介绍了一种通用的基于InP的单片光子集成平台，该平台能够同时集成发射、接收和无源光学功能。在此基础上，实现了太赫兹应用的集成发射机组件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2013 International Conference on Indium Phosphide and Related Materials (IPRM)

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