Application of 1018.2 to Hybrid and VLSI Devices

Abstract

This paper discusses several methods used to determine the amount of moisture within a hybrid or LSI package. Case histories are used to show that moisture measurements alone are not sufficient to analyze most problems. RGA (Residual Gas Analysis) provides data that is invaluable in determining the source of moisture within the package. Several possible sources of moisture will be presented. The results from extensive RGA analyses of hybrids show the validity of this type of testing. Finally recommendations for changes to test method 1018 of MIL-STD-883 as applied to hybrids and VLSI devices are presented. These include: 1) recommended times and temperatures for baking of the device prior to RGA analysis; 2) the time windows for testing after removal from the oven; and 3) acceptable levels of moisture for hybrids and VLSI devices.