Development of a Shock & Vibration Spec for 300mm Wafer AMHS Handling

Abstract

In this work, a technique is presented for establishing and verifying safe vibration and shock limits for preventing cross-slotting of 300mm wafers in FOUPs during AMHS handling. This technique includes establishing the safe limits using a shaker table, calibrating these limits for a particular portable accelerometer, and then using this portable accelerometer to check an AMHS for compliance to these limits