Toward an interconnect programmable CMOS substrate for MCMS

Abstract

Multi-Chip Module (MCM) manufacturing technologies offers a new approach for reducing the size of electronics systems and improving its power consumption and speed. In order to take advantage of this and minimise cost, we should find ways of reusing a substrate in different applications. We have resumed the implementation of first test vehicle and it is presented the developed, characterisation and test of a second prototype (FPS-2M) and some other devices and the environment for test.