Reliability improvements in solder bump processing for flip chips

M. Warrior
{"title":"Reliability improvements in solder bump processing for flip chips","authors":"M. Warrior","doi":"10.1109/ECTC.1990.122229","DOIUrl":null,"url":null,"abstract":"A plated solder-bump process used for the manufacture of high-reliability flip chips is described. Characterization work done to improve the process manufacturability and the resulting product reliability gains are reviewed. Two detailed studies of the thin-film deposition conditions and the Cu pedestal plating parameters are described. Recommendations implemented as a result of these studies have reduced the bump-interconnect-failure level from a defect rate of approximately 500 p.p.m. to <10 p.p.m. Excellent temperature cycling performance of assembled hybrids was obtained. The process has been used in high-volume production to manufacture ICs used in automobiles (under-hood application). In process capability has improved from a C/sub p/<1 to C/sub p/>1.5. This work highlights the need and the benefits of detailed characterization, which results in more robust manufacturing processes and eventually in more reliable product performance.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122229","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 22

Abstract

A plated solder-bump process used for the manufacture of high-reliability flip chips is described. Characterization work done to improve the process manufacturability and the resulting product reliability gains are reviewed. Two detailed studies of the thin-film deposition conditions and the Cu pedestal plating parameters are described. Recommendations implemented as a result of these studies have reduced the bump-interconnect-failure level from a defect rate of approximately 500 p.p.m. to <10 p.p.m. Excellent temperature cycling performance of assembled hybrids was obtained. The process has been used in high-volume production to manufacture ICs used in automobiles (under-hood application). In process capability has improved from a C/sub p/<1 to C/sub p/>1.5. This work highlights the need and the benefits of detailed characterization, which results in more robust manufacturing processes and eventually in more reliable product performance.<>
倒装芯片焊料凸点加工的可靠性改进
描述了一种用于制造高可靠性倒装芯片的镀焊凸点工艺。为提高工艺可制造性和由此产生的产品可靠性所做的表征工作进行了回顾。对薄膜沉积条件和镀铜底座参数进行了详细的研究。作为这些研究结果实施的建议已经将碰撞互连故障水平从大约500ppm的缺陷率降低到1.5 ppm。这项工作强调了详细表征的必要性和好处,这将导致更强大的制造过程,并最终实现更可靠的产品性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
3.10
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信