The Case for Identifying Contact Impedance as the Major Electromagnetic Hardness Degradation Factor

1986 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 1986-09-01 DOI:10.1109/ISEMC.1986.7568277

L. Hoeft

引用次数: 2

Abstract

An examination of a wide range of experimental data shows that contact impedance rather than enlargement of apertures or changes in material con ductivity is the major electromagnetic hardness degradation factor. It is also the least understood.

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确定接触阻抗为主要电磁硬度退化因素的案例

对大量实验数据的研究表明，接触阻抗而不是孔径的扩大或材料电导率的变化是主要的电磁硬度退化因素。它也是最不为人所知的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

1986 IEEE International Symposium on Electromagnetic Compatibility

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