Dual-use Microelectronics Manufacturing Specification for Single and Multichip Packaging Technologies

Abstract

The reliability of systems and equipment is critical for both customer satisfaction and system supportability. As a technology evolves, it cannot be inserted into new systems without knowledge of the implication it has on reliability. Specifications and standards which support the insertion of new technology must be cost effective, practical and acceptable to vendors and users while assuring quality and reliability. This paper describes the strategy and status of a new initiative to develop an industry microelectronic manufacturing specification, using best commercial practices, for silicon (Si), gallium arsenide (GaAs) and hybrid microcircuits as well as multichip modules (MCMs), including chip-on-board (COB), in hermetic or plastic packaging. The intent is to establish a national (ANSI) specification that has worldwide acceptance similar to that of I S 0 9000 l , and is used by the DoD, NASA and commercial industries (i.e., automotive, telecommunications, medical, computer).