What is Killing Moore's Law? Challenges in Advanced FinFET Technology Integration

A. Malinowski, James Chen, S. Mishra, S. Samavedam, D. K. Sohn
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引用次数: 9

Abstract

First microprocessor released to the market in 1971 was consisting of 2300 transistors. Following Moore's law less than five decades later consumer electronic chips consist of billions of transistor reaching densities as much as 100 million transistors in square millimeter Several times in the past it was predicted that technological barriers would slow or even stop CMOS technology scaling trend. Despite these predictions, the monetary benefit of growth has been driving massive research and pathways have been Lays found around those barriers. In 2011 a 3-D tri-gate transistor structure, FinFET, has been introduced into CMOS mainstream manufacturing which was a pathway replacing running out of steam planar technology. However, similarly to the planar technology now FinFET scaling is running out of steam due to difficult technological barriers and integration challenges. In 2021 year last CMOS technology node based on FinFET might be released for production. Difficulties and technology integration challenges outlined in this paper may end 10-year era of FinFET technology.
什么是杀死摩尔定律?先进FinFET技术集成的挑战
1971年投放市场的第一个微处理器由2300个晶体管组成。在摩尔定律之后不到50年的时间里,消费电子芯片由数十亿个晶体管组成,密度达到每平方毫米1亿个晶体管。过去曾多次预测,技术障碍将减缓甚至阻止CMOS技术的扩展趋势。尽管有这些预测,但经济增长带来的经济效益一直在推动大规模的研究,人们已经找到了绕过这些障碍的途径。2011年,3d三栅极晶体管结构FinFET被引入CMOS主流制造,这是取代耗尽蒸汽平面技术的途径。然而,与平面技术类似,由于技术障碍和集成挑战,现在FinFET的缩放正在失去动力。在2021年,最后一个基于FinFET的CMOS技术节点可能会投入生产。本文概述的困难和技术集成挑战可能结束FinFET技术10年的时代。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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