A Globally-optimized Co-design Approach for Heterogeneous Systems Using Convex Optimization

T. Horst, R. Fischbach, J. Lienig
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Abstract

Manufacturing methods for heterogeneous systems allow for high-density integration of multiple semiconductor devices in one system or package. Current design tools and approaches do not incorporate the intensified heterogeneity of 3D systems sufficiently. They provide suboptimal design solutions because the overall global solutions cannot be optimized. In this paper, we present a co-design methodology to globally solve and optimize the design problem and so to fully exploit the potential of emerging technologies. We use a design example to show the advantage and potential of a co-design methodology compared to conventional top-down approaches. Our approach should guide further research and tool development in this emerging field of heterogeneous system design.
基于凸优化的异构系统全局优化协同设计方法
异构系统的制造方法允许在一个系统或封装中高密度集成多个半导体器件。目前的设计工具和方法并没有充分考虑到3D系统的异质性。它们提供了次优的设计解决方案,因为整体全局解决方案无法优化。在本文中,我们提出了一种协同设计方法,以全局解决和优化设计问题,从而充分利用新兴技术的潜力。我们使用一个设计示例来展示与传统的自顶向下方法相比,协同设计方法的优势和潜力。我们的方法应该指导异构系统设计这一新兴领域的进一步研究和工具开发。
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