Electron-beam MCM substrate tester

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI:10.1109/MCMC.1993.302150

M. Brunner, R. Schmid

引用次数: 7

Abstract

An electron beam MCM substrate tester that is now installed in a fabrication line is discussed. It provides a spot size of below 25- mu m to probe pads in a 30 cm*30 cm field without mechanical movement. The test speed is 1000 networks in 15 s. The tester is automated for fabrication environment and ease of operation. Several hundred substrates have already been tested on the system while not missing any defect.<>

查看原文本刊更多论文

电子束MCM衬底测试仪

讨论了目前安装在生产线上的电子束MCM衬底测试仪。它在30厘米*30厘米的范围内为探针垫提供了小于25 μ m的斑点大小，而无需机械运动。测试速度为15秒1000网络。该测试仪是自动化的制造环境和易于操作。数百个基板已经在系统上进行了测试，没有遗漏任何缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93

自引率

0.00%

发文量