Characterization of a new designed octahedron slotted metal track by simulations

Abstract

Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as “power metals” are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for “power metals” was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.