Comparison of Second Impact Ionization Phenomena Between 0.18um N- and P-channel MOSFET's

A. Bravaix, D. Goguenheim, N. Revil, E. Vincent
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引用次数: 1

Abstract

The consequence of the second impact ionization phenomena (2II) with the back-bias VB differs significantly between Nand PMOSFET’s where electron or hole emissions are favored in the ionization processes. In PMOS a direct hole gate-current is now observed like the electronic one, as a function of the lateral field due to the first ionization event (II) which are both strongly reduced with VB during 2II effects. This behavior is opposite to the NMOS one where the II and 2II electronic gate-current is easily enhanced at lower field towards the NMOS gate by the conjonction of the thermionicand tunneling emissions. These results are explained by the localization of the emission point under the gate and by the hole energy loss which reduces the hole gate-current.
0.18um N沟道和p沟道MOSFET二次冲击电离现象的比较
Nand PMOSFET的二次冲击电离现象(2II)与背偏置VB的结果显著不同,在电离过程中电子或空穴发射更有利。在PMOS中,直接空穴门电流与电子电流一样,作为第一次电离事件(II)引起的侧向场的函数,在2II效应期间,两者都被VB强烈地减弱。这种行为与NMOS相反,其中II和2II电子栅极电流很容易在低场中通过热电子和隧道发射的结合而增强。这些结果可以解释为栅极下发射点的局域化和空穴能量损失降低了空穴栅电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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