New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM)

Abstract

Glass and organic interposers have been expected as strong alternatives to Si interposer (Si-IP) from the viewpoint of package cost reduction. A 2.5-D package that consists of HBM Gen 2 and a logic die placed side by side on a glass or an organic interposer by flip-chip bonding (FCB) is studied. We have successfully developed a new signal skew cancellation method by controlling Cu plated through via (PTV) locations, interposer wirings, and signal pin order. It is confirmed that more than 2Gbps, HBM Gen 2 data rate, of signal transmission is doable on the interposers designed by the new method by SPICE simulation. It is also demonstrated that the new method reduces the number of necessary conductive layers, providing a low-cost 2.5-D package solution.