Environment-friendly LF solder SAC 305 and its reliability

Abstract

The article discusses the factors affecting the reliability and the longevity of solder joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of solder joints executed by the leadless solder SAC 305. The tests still continue. To get results of the experiment the test boards were stresses using the thermal cyclic method in range from 0 °C to +100 °C, with the dwell time of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data — number of cycles before the failure — were evaluated with the help of Weibull distribution in a graphical form.