Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC

Abstract

We first verified that the integration level of multifunction MMICs can be easily increased three-fold by using three-dimensional (3-D) MMIC structure, in comparison to planar ones. The technology was used to build high-density masterslice MMICs on a single footprint in 2/spl times/2 mm by incorporating two levels of ground metals in the 3-D structure.