Fabrication of epitaxial tunnel junction on tunnel field effect transistors

Y. Morita, K. Fukuda, T. Mori, T. Matsukawa
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引用次数: 2

Abstract

With an increase in the amount of collected and modified data in today’s "big data" era, the demand for calculation resources in both "cloud" and "edge" has also increased. Circuits consume high power when calculating large amount of data. Presently, advanced microchips consume over 100 W of power, which is a critical problem of realizing the big data/IoT/AI concepts. Reducing the operation voltage (V DD ) of devices is the most effective way to reduce power consumption of chips. The IRDS roadmap predicts ways to simultaneously reduce V DD and "subthreshold swing" (SS) [1] . However, the SS of a MOSFET is limited to 60 mV/decade at room temperature because of its operation mechanism [2] . Thus, remarkably reducing the MOSFET operating voltage is difficult. To overcome this problem, novel devices having different operation mechanisms from the MOSFET are required [3] – [5] .
隧道场效应晶体管外延隧道结的制备
在当今“大数据”时代,随着收集和修改数据量的增加,对“云”和“边缘”计算资源的需求也在增加。当计算大量数据时,电路消耗高功率。目前,先进的微芯片功耗超过100w,这是实现大数据/物联网/人工智能概念的关键问题。降低器件的工作电压(vdd)是降低芯片功耗的最有效途径。IRDS路线图预测了同时减少vdd和“阈下摆动”(SS)的方法[1]。然而,由于MOSFET的工作机制,其在室温下的SS被限制在60 mV/十进[2]。因此,显著降低MOSFET的工作电压是困难的。为了克服这一问题,需要具有与MOSFET不同工作机制的新型器件[3]-[5]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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