Opportunities, challenges and use cases of digitization within the semiconductor industry

G. Schneider, S. Keil, G. Luhn
{"title":"Opportunities, challenges and use cases of digitization within the semiconductor industry","authors":"G. Schneider, S. Keil, G. Luhn","doi":"10.1109/ASMC.2018.8373173","DOIUrl":null,"url":null,"abstract":"Over the last years, Infineon Dresden Technologies has continuously been working on offering innovative products and enhancing the productivity of their wafer fabrication areas by increasing fab capacities as well as increasing automation in their 200 and 300 mm wafer manufacturing plants to improve productivity. One of the most important success factors is use of powerful automated material handling systems (AMHS) combined with the digitization of core processes within the whole company. Digitization supports converting a highly automated fab into a \"smart fab\" by horizontal and vertical integration of the internal supply chains. Within this paper, the authors provide an overview of three use cases for continuous improvement of the manufacturing process through use of automation and digitization to enhance the profitability of the semiconductor manufacturing plant.","PeriodicalId":349004,"journal":{"name":"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2018.8373173","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

Over the last years, Infineon Dresden Technologies has continuously been working on offering innovative products and enhancing the productivity of their wafer fabrication areas by increasing fab capacities as well as increasing automation in their 200 and 300 mm wafer manufacturing plants to improve productivity. One of the most important success factors is use of powerful automated material handling systems (AMHS) combined with the digitization of core processes within the whole company. Digitization supports converting a highly automated fab into a "smart fab" by horizontal and vertical integration of the internal supply chains. Within this paper, the authors provide an overview of three use cases for continuous improvement of the manufacturing process through use of automation and digitization to enhance the profitability of the semiconductor manufacturing plant.
半导体行业数字化的机遇、挑战和用例
在过去的几年中,英飞凌德累斯顿科技公司一直致力于提供创新产品,并通过增加工厂产能以及提高其200和300毫米晶圆制造工厂的自动化程度来提高其晶圆制造领域的生产率。最重要的成功因素之一是使用强大的自动化物料处理系统(AMHS),并结合整个公司核心流程的数字化。数字化支持通过内部供应链的横向和纵向整合,将高度自动化的晶圆厂转变为“智能晶圆厂”。在本文中,作者概述了三个用例,通过使用自动化和数字化来持续改进制造过程,以提高半导体制造工厂的盈利能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信