Impact of BOX scaling on 30 nm gate length FD SOI MOSFET

M. Fujiwara, T. Morooka, N. Yasutake, K. Ohuchi, N. Aoki, H. Tanimoto, M. Kondo, K. Miyano, S. Inaba, K. Ishimaru, H. Ishiuchi
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引用次数: 38

Abstract

This paper presents the first demonstration of ultra-thin BOX FD SOI devices with nominal gate length of 30 nm. The characteristics of FD SOI MOSFETs are investigated in detail as T/sub BOX/ is varied from 5 nm to 145 nm. In addition, optimum design regions of T/sub BOX/ for achieving performance requirements are demonstrated.
BOX缩放对30nm栅极长度FD SOI MOSFET的影响
本文首次展示了标称栅极长度为30nm的超薄BOX FD SOI器件。详细研究了T/sub BOX/在5nm ~ 145nm范围内变化时FD SOI mosfet的特性。此外,还展示了T/sub BOX/的最佳设计区域,以达到性能要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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