Study on palladium germanide on Ge-on-Si substrate for nanoscale Ge channel Schottky barrier MOSFETs

Se-Kyung Oh, Ying-Ying Zhang, H. Shin, I. Han, H. Kwon, Byoungchul Park, Sang-Uk Park, J. Bok, Ga-Won Lee, Jin-Suk Wang, H. Lee
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引用次数: 1

Abstract

In this article, we investigated the fabrication and characteristics of Pd germanide Schottky contacts on n-type Ge substrate. It is shown that the lowest sheet resistance and uniform Pd germanide can be obtained by a one step RTP at 400 °C for 30 sec. The proposed Pd germanide/nGe contact exhibited electron Schottky barrier height and work function of 0.565~0.577 eV and 4.695~4.702 eV, respectively. Therefore, the proposed Pd germanide is promising for the nanoscale Schottky barrier Ge channel MOSFETs.
锗沟道肖特基势垒mosfet衬底上锗化钯的研究
本文研究了n型Ge衬底上锗化Pd肖特基触点的制备及其特性。结果表明,在400℃、30秒条件下,一步RTP可以获得最低的片电阻和均匀的锗化钯。锗化钯/锗接触的电子肖特基势垒高度和功函数分别为0.565~0.577 eV和4.695~4.702 eV。因此,所提出的锗化Pd有望用于纳米肖特基势垒锗沟道mosfet。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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