{"title":"A low-cost MCM design topology-the interconnected mesh power system (IMPS)","authors":"Y. Low, L. Schaper, S. Ang","doi":"10.1109/MCMC.1995.512027","DOIUrl":null,"url":null,"abstract":"A low-cost MCM design topology, the Interconnected Mesh Power System (IMPS), that will reduce a conventional four layer structure to only a two-layer structure and thus eliminate more than 50% of the cost has been developed and tested. Since the IMPS has its unique power distribution system and signal transmission environment, important issues on electrical performance such as, power distribution impedance, characteristic impedance, propagation delay, signal loss, and etc. have to be addressed. In this paper, the design and fabrication of the IMPS are first described, followed by the characterization of signal transmission with various power/signal/ground configurations. The power distribution system of the IMPS with decoupling capacitors attached were also compared with that of the solid power and ground planes.","PeriodicalId":223500,"journal":{"name":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1995.512027","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
A low-cost MCM design topology, the Interconnected Mesh Power System (IMPS), that will reduce a conventional four layer structure to only a two-layer structure and thus eliminate more than 50% of the cost has been developed and tested. Since the IMPS has its unique power distribution system and signal transmission environment, important issues on electrical performance such as, power distribution impedance, characteristic impedance, propagation delay, signal loss, and etc. have to be addressed. In this paper, the design and fabrication of the IMPS are first described, followed by the characterization of signal transmission with various power/signal/ground configurations. The power distribution system of the IMPS with decoupling capacitors attached were also compared with that of the solid power and ground planes.