Innovating at Cloud Speed for IoT, AI, and Semiconductor Design

D. Pellerin
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Abstract

Rapid adoption and production deployments of connected devices, coupled with AI-driven methods of advanced analytics, have led to an explosion in demand for non-traditional, more scalable computing and data management platforms. This increasing demand is being seen in the public cloud as well as in cloud-connected IoT edge devices. AI is at the heart of many the newest, most advanced analytics and IoT applications, ranging from robotics and autonomous vehicles, to cloud-connected products such as Amazon Alexa, to smart factories and consumer-facing services in the financial and healthcare sectors. This talk presents examples of such use-cases within Amazon, as well examples of how Amazon customers increasingly rely on AI coupled with IoT hardware and software stacks, and use cloud-based EDA to innovate faster, and at cloud scales.
以云速度创新物联网、人工智能和半导体设计
连接设备的快速采用和生产部署,加上人工智能驱动的高级分析方法,导致对非传统、更具可扩展性的计算和数据管理平台的需求激增。这种不断增长的需求在公共云和云连接的物联网边缘设备中都可以看到。人工智能是许多最新、最先进的分析和物联网应用的核心,从机器人和自动驾驶汽车,到亚马逊Alexa等云连接产品,再到金融和医疗保健领域的智能工厂和面向消费者的服务。本次演讲展示了亚马逊内部的这些用例示例,以及亚马逊客户如何越来越依赖AI与物联网硬件和软件堆栈,以及如何使用基于云的EDA在云规模上更快地进行创新。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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