Measurement and 3D simulations of substrate noise isolation and resistance for mixed signal applications

Abstract

In this work an enhanced approach to 3D process modeling using mixed element meshes followed by tetrahedralization and small signal device simulation by Fielday is presented. This methodology is then used to analyze and predict the effects of various substrate isolation schemes on substrate noise coupling. Experimental results are used to calibrate and verify the simulation results. Our proposed various substrate isolation test structure results reveal that layout guidelines and isolation parameter analysis are useful in signal isolation optimization.