ESD effect in GMR heads in the trim shunt tab process

Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) Pub Date : 2001-07-09 DOI:10.1109/IPFA.2001.941469

A. Siritaratiwat, N. Suwannata, J. Pinnoi, C. Puprichitkun

引用次数: 1

Abstract

The electrostatic discharge (ESD) effect is widely known as a main cause of damage in giant magnetoresistance (GMR) heads (Wallash and Kim, 1995). The transient current may strike the GMR head directly by passing the leads (Li-Yan Zhu, 1999) and this may be prevented by shunting the GMR leads (Bajorek et al, 1995). However, after completing the head gimbal assembly (HGA) production, the shunt leads have to be trimmed in order to test its electrical characteristics. This is thought to cause the ESD effect while trimming the shunt tab of a GMR head, and is investigated here.

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在微调分流卡卡过程中，GMR磁头中的ESD效应

众所周知，静电放电(ESD)效应是巨磁电阻(GMR)磁头损坏的主要原因(Wallash和Kim, 1995)。暂态电流可以通过引线直接冲击GMR磁头(朱立岩，1999)，这可以通过分流GMR引线来防止(Bajorek等人，1995)。然而，在完成头万向节组件(HGA)生产后，分流引线必须修剪，以测试其电气特性。在修整GMR头的分流标签时，这被认为会导致ESD效应，并在这里进行了研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)

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