Test vehicle for a wafer-scale thermal pixel scene simulator

G. Chapman, L. Carr, M. Syrzycki, B. Dufort
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引用次数: 10

Abstract

A chip sized test vehicle has been created to experiment with two wafer scale thermal pixel displays: a Thermal Pixel Dynamic Scene Simulator and a Visual-to-Thermal Converter. The 4.7/spl times/4.7 mm device contains a 2/spl times/4 array of micromachined thermal pixels, optical detectors, A/D converters, digital pixel control circuitry, and laser links for interconnection. Laser produced defect avoidance schemes allowed testing and harvesting for global redundancy of the control circuitry and local transducer substitution. Also the laser linked signal buses flexibility were used to arrange the chip in different thermal pixel display configurations. Two chips were laser interconnected, one as fabricated and another where anisotropic etching had created a suspended plate holding the polysilicon resistor thermal pixels. From the electrical and laser interconnection points of operation there was no difference between the etched and unetched circuits.<>
测试车辆的晶圆规模热像素场景模拟器
一个芯片大小的测试车辆已经创建了两个晶圆级热像素显示实验:热像素动态场景模拟器和视觉-热转换器。4.7/spl倍/4.7 mm器件包含2/spl倍/4微加工热像素阵列、光学探测器、a /D转换器、数字像素控制电路和用于互连的激光链路。激光产生的缺陷避免方案允许测试和收获控制电路的全局冗余和局部换能器替代。利用激光链接信号总线的灵活性,将芯片排列成不同的热像素显示结构。两个芯片被激光互连,一个是预制的,另一个是各向异性蚀刻产生的悬浮板,容纳多晶硅电阻的热像素。从操作的电气和激光互连点来看,蚀刻电路和未蚀刻电路之间没有区别。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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