{"title":"[Copyright notice]","authors":"","doi":"10.23919/iwlpc.2019.8913976","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":373797,"journal":{"name":"2019 International Wafer Level Packaging Conference (IWLPC)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Wafer Level Packaging Conference (IWLPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/iwlpc.2019.8913976","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0