{"title":"A New Miniaturized Type of Three-Dimensional SiGe 90° Hybrid Coupler at 20 GHz using The Meandering TFMS and Stripline Shunt Stub Loading","authors":"K. Hettak, G. Morin, M. Stubbs","doi":"10.1109/MWSYM.2007.380211","DOIUrl":null,"url":null,"abstract":"This paper proposes a new scheme for realizing a compact 3-D 90deg hybrid coupler based on the compact meandered thin-film microstrip (TFMS) transmission line and stripline shunt stub loading, and successfully demonstrated by using the multi-layer 0.35 mum SiGe HBT Jazz process. The proposed coupler takes advantage of the multi-level metallization processes offered in SiGe technology. The intrinsic area of the fabricated 3-D hybrid coupler is significantly reduced and has shown a size reduction of 92% in circuit area at 20 GHz compared to that of a conventional hybrid coupler using the TFMS configuration. Experimental results are presented in support of the novel miniature coupler.","PeriodicalId":213749,"journal":{"name":"2007 IEEE/MTT-S International Microwave Symposium","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE/MTT-S International Microwave Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2007.380211","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper proposes a new scheme for realizing a compact 3-D 90deg hybrid coupler based on the compact meandered thin-film microstrip (TFMS) transmission line and stripline shunt stub loading, and successfully demonstrated by using the multi-layer 0.35 mum SiGe HBT Jazz process. The proposed coupler takes advantage of the multi-level metallization processes offered in SiGe technology. The intrinsic area of the fabricated 3-D hybrid coupler is significantly reduced and has shown a size reduction of 92% in circuit area at 20 GHz compared to that of a conventional hybrid coupler using the TFMS configuration. Experimental results are presented in support of the novel miniature coupler.