{"title":"The brazing of metal-ceramic insulator package","authors":"Wangchen Tu, Chuanzhen Chen, Kai Wangluning","doi":"10.1109/EPTC.2003.1298726","DOIUrl":null,"url":null,"abstract":"With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2003.1298726","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
With the development of the IC technology, the metal-ceramic insulator package is widely used in IC packaging and gradually develop a series of products, which play an important role in package field. Despite the type of the package differ from each other, the basic structure is same. A metal-ceramic insulator is usually consist of a base, a frame, leads, solder and ceramic insulator which is produced by means of brazing. In following passage, it takes JF04F3 package as an example to make detailed introduction.