New Silicon Frontiers: Physically Flexible System-On-A-Chip

Abstract

Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. Advances in converting commercial off-the-shelf products into the physically flexible FleX-IC format are presented. This paper examines the FleX-SoC, physically flexible System-on-Chip, and reports evaluation of the NVM after bending with a radius of curvature down to 5mm.