OYSTER, a 3D structural simulator for microelectromechanical design

IEEE Micro Electro Mechanical Systems, , Proceedings, 'An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots' Pub Date : 1989-02-20 DOI:10.1109/MEMSYS.1989.77967

G. Koppelman

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引用次数: 7

Abstract

OYSTER simulated the geometric effects of sequential IC (integrated circuit) process stages, including patterning of photoresists with planar masks, in order to produce three-dimensional polyhedral representations of all material structures in a design cell after each process stage. It has been developed for IC simulation but is applicable to microelectromechanical systems manufactured using similar processes. The polyhedral models may be used with various analytic procedures as sources of geometric data for finite-element calculations, or they may be subjected to interference calculations, or inspected to detect structural anomalies. As used in IC simulations, OYSTER provides the ability to introduce worst-case or stochastic manufacturing variations in mask alignment, etch depth, or deposition thickness. The author presents examples of variations in mask alignment and calculates resultant variations in center of gravity and moments of inertia for simple micromechanical objects.<>

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OYSTER，一个用于微机电设计的三维结构模拟器

OYSTER模拟了连续IC(集成电路)工艺阶段的几何效应，包括平面掩模的光刻胶图案，以便在每个工艺阶段后在设计单元中产生所有材料结构的三维多面体表示。它是为集成电路仿真而开发的，但适用于使用类似工艺制造的微机电系统。多面体模型可以与各种分析程序一起使用，作为有限元计算的几何数据来源，也可以进行干涉计算，或检查以检测结构异常。在IC模拟中，OYSTER提供了在掩模对准、蚀刻深度或沉积厚度方面引入最坏情况或随机制造变化的能力。作者给出了掩模对准变化的例子，并计算了简单微机械物体的重心和转动惯量的变化

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Micro Electro Mechanical Systems, , Proceedings, 'An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots'

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