Dynamic capacity modeling [IC manufacture]

Abstract

Semiconductor fabricators often experience large part number variations and short product lives which can lead to capacity shortfalls. Fluctuation in part number mix can lead to multiple pinch points in the production process. In order to contain wafer starts, new process qualification must be quickly implemented. However, this may introduce "risk" into the line work in process (WIP). In addition, any production pinch points will hamper the fabricator's ability to maintain adequate line cycle time. This paper demonstrates a methodology that can be used to relate part number variation in the fabricator to the available tool capacity in various process sectors. This methodology allows for real time analysis, and is primarily intended for proactive management of capacity-constrained production sectors.