Deformation characteristics of SOI structures at cryogenic temperatures

A. Druzhinin, Y. Khoverko, Iu. Kogut, V. Holota
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Abstract

We investigate the strain-induced effect in silicon-on-insulator structures (SOI) doped with boron impurities to the vicinity of a metal-dielectric transition. The studies of gauge-factor of polycrystalline silicon films in SOI-structures with boron concentration ranging from 2.4×1018 cm−3 to 1.7×1020 cm−3 were conducted in the temperature range 4, 2–100 K. The possibility of use of polycrystalline films in mechanical sensors, operable in cryogenic temperatures is discussed. We found that the gauge factor of SOI-structure depends on the mobility of charge carriers.
SOI结构在低温下的变形特性
我们研究了在金属-介电跃迁附近掺杂硼杂质的绝缘体上硅结构(SOI)的应变诱导效应。在4,2 - 100 K的温度范围内,研究了硼浓度为2.4×1018 cm−3 ~ 1.7×1020 cm−3的soi结构中多晶硅薄膜的量规因子。讨论了在低温下可操作的机械传感器中使用多晶薄膜的可能性。我们发现soi结构的规范因子取决于载流子的迁移率。
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