Mixed-dimensional 2D/3D photodetectors with high performance and new functions

Chi Liu, Dongming Sun
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Abstract

Due to its atomic thickness and unique energy band structure, 2D semiconductor materials show unique advantages in the field of photodetector devices. However, its further development calls for improving the detectivity, increasing the array integration density, as well as developing processing technologies with large-area, high-resolution and compatible with mainstream semiconductor processes. Here, using a mixed-dimensional hetero-structure strategy, we demonstrated 2D/3D photodetectors including a double heterojunction photodetector with a record-high detectivity of 9.8×1016 cm Hz1/2 W−1, a photon-controlled diode with a new signal processing behaviour to increase the array integration density, and a 1024-pixel high-performance image sensor array fabricated by a wafer-scale combination patterning method. These photodetectors with high performance and new functions expands the research frontier of mixed-dimensional hetero-structure devices.
具有高性能和新功能的混合维2D/3D光电探测器
二维半导体材料由于其原子厚度和独特的能带结构,在光电探测器器件领域显示出独特的优势。然而,它的进一步发展需要提高探测能力,增加阵列集成密度,以及开发大面积、高分辨率和与主流半导体工艺兼容的加工技术。在这里,我们采用混合维异质结构策略,展示了2D/3D光电探测器,包括具有创纪录高探测率9.8×1016 cm Hz1/2 W−1的双异质结光电探测器,具有新的信号处理行为的光子控制二极管,以增加阵列集成密度,以及通过晶圆尺度组合图像化方法制造的1024像素高性能图像传感器阵列。这些具有高性能和新功能的光电探测器拓展了混合维异质结构器件的研究前沿。
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