Pressure measurements in a batch type Vapour Phase Soldering Station

Z. Péter, A. Géczy, B. Illés, Z. Illyefalvi-Vitéz
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Abstract

As Vapour Phase Soldering (VPS) has again become a significant alternative method for reflow soldering [1], several investigations are in progress to determine the possibilities of the re-introduced technology. During Vapour Phase Soldering Galden fluid is heated, forming a layer of vapour inside the sealed processing zone of a VPS station. The controlling of transferred heat is done through condensation, and the amount of condensation depends on the temperature of the board and the amount of available vapour. The basic method of VPS implies soldering should be carried out under steady state conditions with saturated vapour. Therefore, identification of the level of the saturated vapour layer is essential. Yet, this is commonly accomplished only by temperature measurements inside the processing zone [2]. This paper presents how pressure parameters of the processing zone of an experimental VPS system were measured with novel methods. The results indicate that from the aspect of soldering, the saturated vapour indication is more precise and immediate than temperature measurements with thermocouples.
间歇式气相焊接站的压力测量
随着气相焊接(VPS)再次成为回流焊接的重要替代方法,一些研究正在进行中,以确定重新引入技术的可能性。在气相焊接过程中,加热流体,在VPS站的密封处理区内形成一层蒸汽。传热的控制是通过冷凝来完成的,而冷凝的量取决于板的温度和可用蒸汽的量。VPS的基本方法意味着焊接应在饱和蒸汽的稳态条件下进行。因此,确定饱和蒸汽层的水平是必不可少的。然而,这通常只能通过加工区域[2]内的温度测量来完成。本文介绍了用新方法测量实验VPS系统加工区的压力参数。结果表明,从焊接的角度来看,饱和蒸气指示比热电偶温度测量更精确和直接。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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